Banner photo captions: View of Engineering Hall and Maquina fountain from the north.

PlasmaEtch PE-200 Oxygen Plasma Etcher PlasmaEtch PE-200 Oxygen Plasma Etcher
PlasmaEtch PE-200 Plasma Surface Treatment and Etching System is used for surface activation and etching with a variety of materials. Plasma etching cleans organic contamination from metal, ceramic, or plastic surfaces, which enhances the adhesive and bond strength of such surfaces. Plasma can be used to clean and etch odd shaped parts with hard to reach areas. The plasma process can be readily controlled and may be repeated safely, ensuring uniform results.

Characteristics

RF power: 250 W max @ 13.56 MHz
Gases available: oxygen (nitrogen for purge)
Process Gas flow: 0 - 200 cc/min
Electrode configuration: horizontal planar